Quantitative Thermopower Profiling across a Silicon p-n Junction with Nanometer Resolution
- Authors
- Lee, Byeonghee; Kim, Kyeongtae; Lee, Seungkoo; Kim, Jong Hoon; Lim, Dae Soon; Kwon, Ohmyoung; Lee, Joon Sik
- Issue Date
- 9월-2012
- Publisher
- AMER CHEMICAL SOC
- Keywords
- Scanning Seebeck microscopy; diamond thermocouple probe; quantitative profiling; thermopower; carrier density; nanometer resolution
- Citation
- NANO LETTERS, v.12, no.9, pp.4472 - 4476
- Indexed
- SCIE
SCOPUS
- Journal Title
- NANO LETTERS
- Volume
- 12
- Number
- 9
- Start Page
- 4472
- End Page
- 4476
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/107513
- DOI
- 10.1021/nl301359c
- ISSN
- 1530-6984
- Abstract
- Thermopower (S) profiling with nanometer resolution is essential for enhancing the thermoelectric figure of merit, ZT, through the nanostructuring of materials and for carrier density profiling in nanoelectronic devices. However, only qualitative and impractical methods or techniques with low resolutions have been reported thus far. Herein, we develop a quantitative S profiling method with nanometer resolution, scanning Seebeck microscopy (SSM), and batch-fabricate diamond thermocouple probes to apply SSM to silicon, which requires a contact stress higher than 10 GPa for stable electrical contact. The distance between the positive and negative peaks of the S profile across the silicon p-n junction measured by SSM is 4 nm, while the theoretical distance is 2 nm. Because of its extremely high spatial resolution, quantitative measurement, and ease of use, SSM could be a crucial tool not only for the characterization of nano-thermoelectric materials and nanoelectronic devices but also for the analysis of nanoscale thermal and electrical phenomena in general.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - College of Engineering > Department of Materials Science and Engineering > 1. Journal Articles
- College of Engineering > Department of Mechanical Engineering > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.