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Mobility analysis of surface roughness scattering in FinFET devices

Authors
Lee, Jae WooJang, DoyoungMouis, MireilleKim, Gyu TaeChiarella, ThomasHoffmann, ThomasGhibaudo, Gerard
Issue Date
8월-2011
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Keywords
FinFET; Low temperature measurement; Effective mobility; Surface separation; Surface roughness scattering
Citation
SOLID-STATE ELECTRONICS, v.62, no.1, pp.195 - 201
Indexed
SCIE
SCOPUS
Journal Title
SOLID-STATE ELECTRONICS
Volume
62
Number
1
Start Page
195
End Page
201
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/111848
DOI
10.1016/j.sse.2011.04.020
ISSN
0038-1101
Abstract
This paper presents a mobility analysis of the surface roughness scattering along the different interfaces of FinFET devices. Using temperature dependent analysis of effective mobility, quantitative information about the influence of the roughness could be obtained directly on the device. The sidewall and top surface drain current components were estimated from the total drain currents of different fin width conditions. Using a conventional mobility model, it was possible to fit the gate voltage and temperature dependence of sidewall and top surface mobilities. This procedure allowed the contribution of the surface roughness scattering to be quantified with nondestructive characterization. Significant differences were observed for sidewalls and top surface. In the specific case under study, surface roughness scattering on sidewalls was about three times stronger than on top surface for n-channel FinFETs, whereas it remained similar for p-channel ones. (C) 2011 Elsevier Ltd. All rights reserved.
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공과대학 (전기전자공학부)
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