Improved device performance in nonpolar a-plane GaN LEDs using a Ni/Al/Ni/Au n-type ohmic contact
DC Field | Value | Language |
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dc.contributor.author | Kim, Dong Ho | - |
dc.contributor.author | Kim, Su Jin | - |
dc.contributor.author | Kim, Seung Hwan | - |
dc.contributor.author | Jeong, Tak | - |
dc.contributor.author | Hwang, Sung Min | - |
dc.contributor.author | Kim, Tae Geun | - |
dc.date.accessioned | 2021-09-07T09:59:42Z | - |
dc.date.available | 2021-09-07T09:59:42Z | - |
dc.date.created | 2021-06-19 | - |
dc.date.issued | 2011-08 | - |
dc.identifier.issn | 1862-6254 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/111921 | - |
dc.description.abstract | The authors report upon the increased light-output power (P(out)) via a reduction in the forward voltage (V(f)) for nonpolar a-plane GaN LEDs using Ni/Al/Ni/Au n-type ohmic contacts. The specific contact resistivity of the Ni/Al/Ni/Au contact is found to be as low as 5.6 x 10 (5) whereas that of a typical Ti/Al/Ni/Au contact is 6.8 x 10(-4) cm(2), after annealing at 700 degrees C. The X-ray photoelectron spectroscopy results show that the upward surface band bending is less pronounced for the Ni/Al contact compared to the Ti/Al contact, leading to a decrease in the effective Schottky barrier height (SBH). The V(f) of the nonpolar LEDs decreases by 10% and P(out) increases by 15% when the Ni/Al/Ni/Au scheme is used instead of the typical Ti/Al/Ni/Au metal scheme. (C) 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | WILEY-BLACKWELL | - |
dc.subject | VAPOR-PHASE EPITAXY | - |
dc.subject | SAPPHIRE | - |
dc.title | Improved device performance in nonpolar a-plane GaN LEDs using a Ni/Al/Ni/Au n-type ohmic contact | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kim, Tae Geun | - |
dc.identifier.doi | 10.1002/pssr.201105265 | - |
dc.identifier.scopusid | 2-s2.0-79961080800 | - |
dc.identifier.wosid | 000294746700006 | - |
dc.identifier.bibliographicCitation | PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS, v.5, no.8, pp.274 - 276 | - |
dc.relation.isPartOf | PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS | - |
dc.citation.title | PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS | - |
dc.citation.volume | 5 | - |
dc.citation.number | 8 | - |
dc.citation.startPage | 274 | - |
dc.citation.endPage | 276 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.subject.keywordPlus | VAPOR-PHASE EPITAXY | - |
dc.subject.keywordPlus | SAPPHIRE | - |
dc.subject.keywordAuthor | nonpolar GaN | - |
dc.subject.keywordAuthor | LED | - |
dc.subject.keywordAuthor | Ni-Al alloys | - |
dc.subject.keywordAuthor | current injection | - |
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