Preparation and Thermal Analysis of Sn-Ag Nano Solders
- Authors
- Bao, Tran Thai; Kim, Yunkyum; Lee, Joonho; Lee, Jung-Goo
- Issue Date
- Dec-2010
- Publisher
- JAPAN INST METALS
- Keywords
- arc discharge process; differential scanning calorimeny; nano solder; phase diagram; tin-silver alloy
- Citation
- MATERIALS TRANSACTIONS, v.51, no.12, pp.2145 - 2149
- Indexed
- SCIE
SCOPUS
- Journal Title
- MATERIALS TRANSACTIONS
- Volume
- 51
- Number
- 12
- Start Page
- 2145
- End Page
- 2149
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/115212
- DOI
- 10.2320/matertrans.MJ201013
- ISSN
- 1345-9678
- Abstract
- In this study, Sn-Ag nano solders of three different compositions (Sn-1.0 mass%Ag, Sn-3.5 mass%Ag and Sn-6.5 mass%Ag) were synthesized via arc-discharge process. The properties of Sn-Ag nano solders were analyzed using X-ray Diffraction (XRD), Transmission Electron Microscopy (TEM), Scanning Electron Microscopy (SEM), Energy Dispersive X-ray spectroscopy (EDX), and Differential Scanning Calorimetry (DSC). Particle size relatively widely ranged from 10 nm to 340 nm. For Sn-1.0 mass%Ag and Sn-3.5 mass%Ag, average size was 200 similar to 240 nm, and that for Sn-6.5 mass%Ag was 40 similar to 50 nm with some extra-ordinary large particles of similar to 100 nm. The melting points of the prepared SnAg nano solders were examined with DSC at different heating rates 1K, 3 K and 5 K/min. The congruent melting point of Sn-Ag nano solders was found to be 487 K. [doi:10.2320/matertrans.MJ201013]
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