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Thickness controlled and smooth polycrystalline CVD diamond film deposition on SiO2 with electrostatic self assembly seeding process

Authors
Kim, J. H.Lee, S. K.Kwon, O. M.Hong, S. I.Lim, D. S.
Issue Date
10월-2009
Publisher
ELSEVIER SCIENCE SA
Keywords
Thickness control; Nano diamond; Electrostatic self assembly; Hot filament CVD
Citation
DIAMOND AND RELATED MATERIALS, v.18, no.10, pp.1218 - 1222
Indexed
SCIE
SCOPUS
Journal Title
DIAMOND AND RELATED MATERIALS
Volume
18
Number
10
Start Page
1218
End Page
1222
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/119222
DOI
10.1016/j.diamond.2009.04.012
ISSN
0925-9635
Abstract
Sub micrometer thick continuous CVD diamond film was synthesized on thermally grown SiO2 film employing the electrostatic self assembly seeding with nano-meter sized ultra dispersed diamond particles. Hot filament CVD system was used to deposit diamond film. Formation of mono-dispersed and mono-layered nano diamond seeding layer by well-known Electrostatic Self-Assembly method was effective to increase density and homogeneity of seeding particles. Because of high density of uniformed seeding particles, the nm controlled continuous CVD films with the surface roughness of less than 13 nm on silicon oxide without any mechanical damage were obtained. Linear growth rate with short incubation time was also observed. Depending on the film thickness, coloring effect was observed ranging from blue to yellow and orange. There was no visible fringe on the coated surface which affirms the good thickness uniformity. (C) 2009 Elsevier B.V. All rights reserved.
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College of Engineering > Department of Mechanical Engineering > 1. Journal Articles
College of Engineering > Department of Chemical and Biological Engineering > 1. Journal Articles
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공과대학 (기계공학부)
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