Micromachining of Multilayer Thin Films for High-Speed Humidity Sensor Fabrication
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Myung Jin | - |
dc.contributor.author | Kim, Jae Sung | - |
dc.contributor.author | Kwak, Ki-Young | - |
dc.contributor.author | Min, Nam-Ki | - |
dc.date.accessioned | 2021-09-08T14:59:53Z | - |
dc.date.available | 2021-09-08T14:59:53Z | - |
dc.date.created | 2021-06-10 | - |
dc.date.issued | 2009-08 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/119526 | - |
dc.description.abstract | This paper reports the microfabrication and characteristics of a novel high-speed polyimide-based humidity sensor using an etch process based on a combination of isotropic and anisotropic etching steps with inductively coupled plasma (ICP) and a localized curing of polyimide films on microhotplate. The polyimide capacitive humidity sensors showed a sensitivity of 0.77 pF/percent relative humidity (%RH), a linearity of 0.9995, and a hysteresis of 0.62%RH, a response time of 3 s. In comparison, the sensors with a conventional structure exhibited a time response of 7s. High speed is achieved because a device has many holes and moisture is thus absorbed into the top and side surfaces of polyimide. (C) 2009 The Japan Society of Applied Physics | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | IOP PUBLISHING LTD | - |
dc.subject | ETCHING CHARACTERISTICS | - |
dc.subject | MECHANISM | - |
dc.subject | SI | - |
dc.title | Micromachining of Multilayer Thin Films for High-Speed Humidity Sensor Fabrication | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Min, Nam-Ki | - |
dc.identifier.doi | 10.1143/JJAP.48.08HG01 | - |
dc.identifier.scopusid | 2-s2.0-77952717649 | - |
dc.identifier.wosid | 000269497800014 | - |
dc.identifier.bibliographicCitation | JAPANESE JOURNAL OF APPLIED PHYSICS, v.48, no.8 | - |
dc.relation.isPartOf | JAPANESE JOURNAL OF APPLIED PHYSICS | - |
dc.citation.title | JAPANESE JOURNAL OF APPLIED PHYSICS | - |
dc.citation.volume | 48 | - |
dc.citation.number | 8 | - |
dc.type.rims | ART | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | ETCHING CHARACTERISTICS | - |
dc.subject.keywordPlus | MECHANISM | - |
dc.subject.keywordPlus | SI | - |
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