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Micromachining of Multilayer Thin Films for High-Speed Humidity Sensor Fabrication

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dc.contributor.authorLee, Myung Jin-
dc.contributor.authorKim, Jae Sung-
dc.contributor.authorKwak, Ki-Young-
dc.contributor.authorMin, Nam-Ki-
dc.date.accessioned2021-09-08T14:59:53Z-
dc.date.available2021-09-08T14:59:53Z-
dc.date.created2021-06-10-
dc.date.issued2009-08-
dc.identifier.issn0021-4922-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/119526-
dc.description.abstractThis paper reports the microfabrication and characteristics of a novel high-speed polyimide-based humidity sensor using an etch process based on a combination of isotropic and anisotropic etching steps with inductively coupled plasma (ICP) and a localized curing of polyimide films on microhotplate. The polyimide capacitive humidity sensors showed a sensitivity of 0.77 pF/percent relative humidity (%RH), a linearity of 0.9995, and a hysteresis of 0.62%RH, a response time of 3 s. In comparison, the sensors with a conventional structure exhibited a time response of 7s. High speed is achieved because a device has many holes and moisture is thus absorbed into the top and side surfaces of polyimide. (C) 2009 The Japan Society of Applied Physics-
dc.languageEnglish-
dc.language.isoen-
dc.publisherIOP PUBLISHING LTD-
dc.subjectETCHING CHARACTERISTICS-
dc.subjectMECHANISM-
dc.subjectSI-
dc.titleMicromachining of Multilayer Thin Films for High-Speed Humidity Sensor Fabrication-
dc.typeArticle-
dc.contributor.affiliatedAuthorMin, Nam-Ki-
dc.identifier.doi10.1143/JJAP.48.08HG01-
dc.identifier.scopusid2-s2.0-77952717649-
dc.identifier.wosid000269497800014-
dc.identifier.bibliographicCitationJAPANESE JOURNAL OF APPLIED PHYSICS, v.48, no.8-
dc.relation.isPartOfJAPANESE JOURNAL OF APPLIED PHYSICS-
dc.citation.titleJAPANESE JOURNAL OF APPLIED PHYSICS-
dc.citation.volume48-
dc.citation.number8-
dc.type.rimsART-
dc.type.docTypeArticle; Proceedings Paper-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusETCHING CHARACTERISTICS-
dc.subject.keywordPlusMECHANISM-
dc.subject.keywordPlusSI-
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