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Characterization of etch resistance property of imprinting resin
- Issue Date
- 9월-2008
- Publisher
- KOREAN INST METALS MATERIALS
- Keywords
- nanoimprint lithography; imprint resin; etch resistance; M-PDMS (methacryloxypropyl terminated poly-dimethylsiloxanes); bi-layer imprint; benzylmethacrylate
- Citation
- ELECTRONIC MATERIALS LETTERS, v.4, no.3, pp.141 - 145
- Indexed
- SCIE
SCOPUS
KCI
OTHER
- Journal Title
- ELECTRONIC MATERIALS LETTERS
- Volume
- 4
- Number
- 3
- Start Page
- 141
- End Page
- 145
- ISSN
- 1738-8090
- Abstract
- Nanoimprint lithography has been intensively researched since it can fabricate nano-scale patterns on large area substrates. Thermal nanoimprinting, using a monomer-based resist has gained more interest due to its shorter process time and lower process temperature, compared to the conventional hot embossing process. A near-zero residual layer imprint process can also be done using monomer-based imprint resin, due to its low viscosity. However, the poor etch resistance of monomer-based imprint resin limits its possible applications. In this study, Methacryloxypropyl terminated Poly-Dimethylsiloxanes material was added to a monomer-based thermal imprint resin, and its effect on etch resistance and imprintability was investigated.
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