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EFFECT OF FABRICATION ON HIGH CYCLE FATIGUE PROPERTIES OF COPPER THIN FILMS

Authors
Park, Jun-HyubAn, Joong-HyokKim, Yun-JaeChoi, Hyeon-Chang
Issue Date
8월-2008
Publisher
SPRINGER
Keywords
mechanical properties; thin film; copper; high cycle fatigue test
Citation
ACTA MECHANICA SOLIDA SINICA, v.21, no.4, pp.318 - 326
Indexed
SCIE
SCOPUS
Journal Title
ACTA MECHANICA SOLIDA SINICA
Volume
21
Number
4
Start Page
318
End Page
326
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/122887
DOI
10.1007/s10338-008-0837-y
ISSN
0894-9166
Abstract
The influence of fabrication on the tensile and fatigue behavior of copper films manufactured by 3 kinds of fabrication methods was investigated. The tensile and high cycle fatigue tests were performed using the test machine developed by authors. Young's moduli (72, 71 and 69 GPa, respectively) are lower than the literature values (108-145 GPa), while the yield strengths were as high as 358, 350 and 346 MPa, respectively and the ultimate strengths as 462, 456 and 446 MPa, respectively. There is not much difference in the tensile properties of the 3 kinds of films. There is little difference in the fatigue properties of the 3 kinds of films but one of them has shorter fatigue life than others in high cycle region and longer fatigue life than others in low cycle region.
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