Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate
- Authors
- Son, Junhyuk; Yu, Dong-Yurl; Kim, Min-Su; Ko, Yong-Ho; Byun, Dong-Jin; Bang, Junghwan
- Issue Date
- 2월-2021
- Publisher
- MDPI
- Keywords
- lead-free solder; intermetallic compound; dipping test; shear strength; nucleation kinetics
- Citation
- METALS, v.11, no.2, pp.1 - 12
- Indexed
- SCIE
SCOPUS
- Journal Title
- METALS
- Volume
- 11
- Number
- 2
- Start Page
- 1
- End Page
- 12
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/129287
- DOI
- 10.3390/met11020210
- ISSN
- 2075-4701
- Abstract
- The nucleation kinetics and morphology of Cu6Sn5 IMCs at the interface between a Sn-0.7Cu-0.2Cr solder and Cu substrate were investigated in this study. A Sn-0.7Cu solder was utilized as a reference to elucidate the impact of Cr addition. The mechanical properties of the solder joints were determined via ball-shear tests. Cu coupons were dipped in the molten solders for 1 and 3 s at 240-300 degrees C, and the morphological analyses were conducted via electron microscopy. Both the solders contained scallop-like Cu6Sn5 IMCs. The smallest Cu6Sn5 IMCs were observed at 260 degrees C in both the solders, and the particle size increased at 280 and 300 degrees C. The IMCs in the Sn-0.7Cu-0.2Cr solder were smaller and thinner than those in the Sn-0.7Cu solder at all the reaction temperatures. The thickness of the IMCs increased as the reaction temperature increased. Inverse C-type nucleation curves were obtained, and the maximum nucleation rate was observed at an intermediate temperature. The shear strengths of the Sn-0.7Cu-0.2Cr solder joints were higher than those of the Sn-0.7Cu solder joints. This study will facilitate the application of lead-free solders, such as Sn-0.7Cu-0.2Cr, in automotive electrical components.
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