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Thermal and Thermoelectric Properties of SAM-Based Molecular Junctions

Authors
Park, SohyunYoon, Hyo Jae
Issue Date
5월-2022
Publisher
AMER CHEMICAL SOC
Keywords
thermoelectrics; liquid metal; molecular junctions; thermal conduction; self-assembled monolayer (SAM)
Citation
ACS APPLIED MATERIALS & INTERFACES, v.14, no.20, pp.22818 - 22825
Indexed
SCIE
SCOPUS
Journal Title
ACS APPLIED MATERIALS & INTERFACES
Volume
14
Number
20
Start Page
22818
End Page
22825
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/135805
DOI
10.1021/acsami.1c20840
ISSN
1944-8244
Abstract
In molecular thermoelectrics, the thermopower of molecular junctions is closely interlinked with their thermal properties; however, the detailed relationship between them remains uncertain. This study systematically investigates the thermal properties of self-assembled monolayer (SAM)-based molecular junctions and relates them to the thermoelectric performance of the junctions. The electrode temperatures for the bare Au-TS, Au-TS/EGaIn, and Au-TS/TPT SAM//Ga2O3/EGaIn samples placed on a hot chuck were measured under different conditions, such as air vs vacuum and the presence and absence of thermal grease, which generates a heat conduction channel from a hot chuck to gold. It was revealed that the SAM was the most efficient thermal resistor, which was responsible for the creation of a temperature differential (Delta T) across the junction; Delta T in an air atmosphere is overestimated to some extent, and air mainly contributes to large dispersions of thermovoltage (Delta V) data. While junction measurements in air were possible at low Delta T (up to 13 K), the new optimal condition, under a vacuum and with thermal grease, allowed us to examine a wide temperature range up to Delta T = 40 K and obtain a more reliable Seebeck coefficient (S, mu V/K). The value of S under the new condition was similar to 1.4 times higher than that measured in air without thermal grease. Our study shows the potential of liquid-metal-based junctions to reliably investigate heat conduction across nanometer-thick organic films and elaborates on how the thermal properties of molecular junctions affect their thermoelectric performance.
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