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CVD를 이용한 Cu 증착 시 plasma 전처리로 인한 구조적 특성의 비교 분석

Authors
BYUN, Dong Jin
Issue Date
21-May-2009
Publisher
한국재료학회
Citation
2009년도 한국재료학회 춘계학술발표대회 및 제16회 신소재 심포지엄
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/3210
Conference Name
2009년도 한국재료학회 춘계학술발표대회 및 제16회 신소재 심포지엄
Place
KO
Conference Date
2009-05-21
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College of Engineering > Department of Materials Science and Engineering > 2. Conference Papers

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