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6W/25mm2 Inductive Power Transfer for Non-Contact Wafer-Level Testing6W/25mm2 Inductive Power Transfer for Non-Contact Wafer-Level Testing
- Alternative Title
- 6W/25mm2 Inductive Power Transfer for Non-Contact Wafer-Level Testing
- Authors
- Hayun Cecillia Chung
- Issue Date
- 22-2월-2011
- Publisher
- IEEE
- Citation
- IEEE International Solid-State Circuits Conference 2011
- Conference Name
- IEEE International Solid-State Circuits Conference 2011
- Place
- US
- Conference Date
- 2011-02-20
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