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Re-precipitation of Cu6Sn5 onto Ni substrate during thermal aging of solder joints
- Authors
- Huh, Joo Youl
- Issue Date
- 19-2월-2009
- Publisher
- TMS
- Citation
- TMS 2009 Annual Meeting
- Conference Name
- TMS 2009 Annual Meeting
- Place
- US
San Francisco, CA
- Conference Date
- 2009-02-15
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