Thermally assisted nanotransfer printing with sub-20-nm resolution and 8-inch wafer scalability
- Authors
- Park, Tae Wan; Byun, Myunghwan; Jung, Hyunsung; Lee, Gyu Rac; Park, Jae Hong; Jang, Hyun-Ik; Lee, Jung Woo; Kwon, Se Hun; Hong, Seungbum; Lee, Jong-Heun; Jung, Yeon Sik; Kim, Kwang Ho; Park, Woon Ik
- Issue Date
- 7월-2020
- Publisher
- AMER ASSOC ADVANCEMENT SCIENCE
- Citation
- SCIENCE ADVANCES, v.6, no.31
- Indexed
- SCIE
SCOPUS
- Journal Title
- SCIENCE ADVANCES
- Volume
- 6
- Number
- 31
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/54494
- DOI
- 10.1126/sciadv.abb6462
- ISSN
- 2375-2548
- Abstract
- Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transfer printing of functional nanomaterials. Here, we present a very practical thermally assisted nanotransfer printing (T-nTP) process that can easily produce well-ordered nanostructures on an 8-inch wafer via the use of a heat-rolling press system that provides both uniform pressure and heat. We also demonstrate various complex pattern geometries, such as wave, square, nut, zigzag, and elliptical nanostructures, on diverse substrates via T-nTP. Furthermore, we demonstrate how to obtain a high-density crossbar metal-insulator-metal memristive array using a combined method of T-nTP and directed self-assembly. We expect that the state-of-the-art T-nTP process presented here combined with other emerging patterning techniques will be especially useful for the large-area nanofabrication of various devices.
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Collections - College of Engineering > Department of Materials Science and Engineering > 1. Journal Articles
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