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Sn-0.3Ag-0.7Cu Solder의 신뢰성 평가에 관한 연구

Authors
Yoon, Wooyoung
Keywords
solder, Pb-free, SMT
Issue Date
25-4월-2008
Publisher
대한금속재료학회
Citation
2008년도 대한 금속·재료학회 춘계학술대회
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/58676
Conference Name
2008년도 대한 금속·재료학회 춘계학술대회
Place
KO
대전, 대전컨벤션센터
Conference Date
2008-04-24
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College of Engineering > Department of Materials Science and Engineering > 2. Conference Papers

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공과대학 (신소재공학부)
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