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Thermal Modeling and Validation of a Real-World Mobile AP
- Authors
- Gong, Young-Ho; Yoo, Jae Jeong; Chung, Sung Woo
- Issue Date
- 1월-2018
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Keywords
- Mobile Application Processor; Package-on-Package; Temperature; Thermal Modeling
- Citation
- IEEE DESIGN & TEST, v.35, no.1, pp.55 - 62
- Indexed
- SCIE
SCOPUS
- Journal Title
- IEEE DESIGN & TEST
- Volume
- 35
- Number
- 1
- Start Page
- 55
- End Page
- 62
- ISSN
- 2168-2356
- Files in This Item
- There are no files associated with this item.
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