193 nm excimer laser lift-off for AlGaN/GaN high electron mobility transistors

Abstract

AlGaN/GaN HEMTs grown on both-side-polished sapphire substrates were successfully lifted-off with a 193-nm UV excimer laser system. The photon energy of the 193 nm laser is larger than the band gap of AlN and thus it can be used to lift-off AlGaN HEMT structures with AlN or AlGaN interfacial layers grown on sapphire substrates prior to growth of the GaN buffer layers. The lifted-off HEMT chip was warped and showed 25-42% reduction of the saturation drain current. There was no degradation observed either in the forward or reverse gate current-voltage (I-V) characteristics or on the drain punch-through voltage. Based on comparisons of cross-sectional electron micrographs, no additional dislocations were created in the HEMT structures after the laser lift-off process. Reduction in saturation drain current was attributed to relaxation of the lifted-off HEMT structures. Newton's rings and Raman spectrum E2 peak shifts were used to estimate the strain relaxation of the laser lifted-off samples.