Microhotplate-Based High-Speed Polyimide Capacitive Humidity Sensors
- Authors
- Lee, Myong Jin; Min, Nam-Ki; Yoo, Kum-Pyo; Kwak, Ki-Young; Kwon, Kwang-Ho
- Issue Date
- 8월-2009
- Publisher
- AMER SCIENTIFIC PUBLISHERS
- Keywords
- Locally Cured Polyimide; Microhotplate; Capacitive Humidity Sensor
- Citation
- SENSOR LETTERS, v.7, no.4, pp.517 - 522
- Indexed
- SCIE
SCOPUS
- Journal Title
- SENSOR LETTERS
- Volume
- 7
- Number
- 4
- Start Page
- 517
- End Page
- 522
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/119519
- DOI
- 10.1166/sl.2009.1102
- ISSN
- 1546-198X
- Abstract
- Polyimide thin films are locally cured on a sensor chip using MEMS microhotplates as an alternative solution to the conventional thermal curing and evaluated as high-speed humidity sensor materials. The polyimide locally cured at a temperature over 350 degrees C for 1 hour exhibits full imidization. There is no significant difference between the polyimide thin films cured in a conventional convection oven and those cured locally on MEMS microhotplates. The locally cured polyimide humidity sensors with a micro-bridge structure created using front-side etching with XeF2 gas show a sensitivity of 0.77 pF/%RH, a hysteresis of 0.61%RH, and a response time of 2.5 s. They also exhibit a low dielectric loss. In comparison, the sensors with a conventional structure exhibit a time response of 7 s. These results indicate that the locally cured polyimide films may be used as a dielectric material in high speed humidity sensors.
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Collections - College of Science and Technology > Department of Electro-Mechanical Systems Engineering > 1. Journal Articles
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