Fabrication of high-speed polyimide-based humidity sensor using anisotropic and isotropic etching with ICP
DC Field | Value | Language |
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dc.contributor.author | Kim, Jae Sung | - |
dc.contributor.author | Lee, Myung Jin | - |
dc.contributor.author | Kang, Moon-Sik | - |
dc.contributor.author | Yoo, Kum-Pyo | - |
dc.contributor.author | Kwon, Kwang-Ho | - |
dc.contributor.author | Singh, V. R. | - |
dc.contributor.author | Min, Nam Ki | - |
dc.date.accessioned | 2021-09-08T16:50:22Z | - |
dc.date.available | 2021-09-08T16:50:22Z | - |
dc.date.created | 2021-06-10 | - |
dc.date.issued | 2009-05-29 | - |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | https://scholar.korea.ac.kr/handle/2021.sw.korea/120010 | - |
dc.description.abstract | A novel high-speed, high-sensitivity capacitive-type humidity sensor is fabricated by using a new microfabrication process involving combination of directional and isotropic etching with inductively coupled plasma (ICP) etcher and a localized curing of polyimide films on a micro-hotplate. The polyimide humidity sensor is found to have a sensitivity of 0.75 pF/%RH, a linearity of 0.995, a hysteresis of 1.32%RH, a time response of 3 s, and a temperature coefficient of 0.22%RH/degrees C. This high-sensitivity and high-speed device is achieved using the locally-cured polyimide and a sensor structure having many holes and allowing moisture to diffuse through the top and side surfaces of polyimide film. (c) 2009 Elsevier B.V. All rights reserved. | - |
dc.language | English | - |
dc.language.iso | en | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.subject | SI | - |
dc.title | Fabrication of high-speed polyimide-based humidity sensor using anisotropic and isotropic etching with ICP | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Kwon, Kwang-Ho | - |
dc.contributor.affiliatedAuthor | Min, Nam Ki | - |
dc.identifier.doi | 10.1016/j.tsf.2009.01.129 | - |
dc.identifier.scopusid | 2-s2.0-65449158324 | - |
dc.identifier.wosid | 000266696100015 | - |
dc.identifier.bibliographicCitation | THIN SOLID FILMS, v.517, no.14, pp.3879 - 3882 | - |
dc.relation.isPartOf | THIN SOLID FILMS | - |
dc.citation.title | THIN SOLID FILMS | - |
dc.citation.volume | 517 | - |
dc.citation.number | 14 | - |
dc.citation.startPage | 3879 | - |
dc.citation.endPage | 3882 | - |
dc.type.rims | ART | - |
dc.type.docType | Article; Proceedings Paper | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Coatings & Films | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.relation.journalWebOfScienceCategory | Physics, Condensed Matter | - |
dc.subject.keywordPlus | SI | - |
dc.subject.keywordAuthor | Polyimide | - |
dc.subject.keywordAuthor | Local curing | - |
dc.subject.keywordAuthor | Humidity sensor | - |
dc.subject.keywordAuthor | ICP etching | - |
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