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Fabrication of high-speed polyimide-based humidity sensor using anisotropic and isotropic etching with ICP

Authors
Kim, Jae SungLee, Myung JinKang, Moon-SikYoo, Kum-PyoKwon, Kwang-HoSingh, V. R.Min, Nam Ki
Issue Date
29-5월-2009
Publisher
ELSEVIER SCIENCE SA
Keywords
Polyimide; Local curing; Humidity sensor; ICP etching
Citation
THIN SOLID FILMS, v.517, no.14, pp.3879 - 3882
Indexed
SCIE
SCOPUS
Journal Title
THIN SOLID FILMS
Volume
517
Number
14
Start Page
3879
End Page
3882
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/120010
DOI
10.1016/j.tsf.2009.01.129
ISSN
0040-6090
Abstract
A novel high-speed, high-sensitivity capacitive-type humidity sensor is fabricated by using a new microfabrication process involving combination of directional and isotropic etching with inductively coupled plasma (ICP) etcher and a localized curing of polyimide films on a micro-hotplate. The polyimide humidity sensor is found to have a sensitivity of 0.75 pF/%RH, a linearity of 0.995, a hysteresis of 1.32%RH, a time response of 3 s, and a temperature coefficient of 0.22%RH/degrees C. This high-sensitivity and high-speed device is achieved using the locally-cured polyimide and a sensor structure having many holes and allowing moisture to diffuse through the top and side surfaces of polyimide film. (c) 2009 Elsevier B.V. All rights reserved.
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