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On the etching mechanism of ZrO2 thin films in inductively coupled BCl3/Ar plasma

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dc.contributor.authorKim, Mansu-
dc.contributor.authorMin, Nam-Ki-
dc.contributor.authorYun, Sun Jin-
dc.contributor.authorLee, Hyun Woo-
dc.contributor.authorEfremov, Alexander-
dc.contributor.authorKwon, Kwang-Ho-
dc.date.accessioned2021-09-09T11:31:11Z-
dc.date.available2021-09-09T11:31:11Z-
dc.date.created2021-06-15-
dc.date.issued2008-02-
dc.identifier.issn0167-9317-
dc.identifier.urihttps://scholar.korea.ac.kr/handle/2021.sw.korea/124130-
dc.description.abstractThe etching mechanism of ZrO2, thin films in BCl3/Ar plasma was investigated using a combination of experimental and modeling methods. It was found that an increase in the Ar mixing ratio causes the non-monotonic behavior of the ZrO2, etch rate which reaches a maximum of 41.4 nm/min at about 30-35% Ar. Langmuir probe measurements and plasma modeling indicated the noticeable influence of a BCl3/Ar mixture composition on plasma parameters and active species kinetics that results in non-linear changes of both densities and fluxes for Cl. BCl2, and BCl2+. From the model-based analysis of surface kinetics, it was shown that the non-monotonic behavior of the ZrO2, etch rate can be associated with the concurrence of chemical and physical pathways in ion-assisted chemical reaction. (c) 2007 Elsevier B.V. All rights reserved.-
dc.languageEnglish-
dc.language.isoen-
dc.publisherELSEVIER-
dc.subjectDIELECTRIC-CONSTANT MATERIALS-
dc.subjectHIGH-DENSITY-
dc.subjectGLOBAL-MODEL-
dc.subjectELECTRON TEMPERATURES-
dc.subjectZIRCONIUM-OXIDE-
dc.subjectSILICON-
dc.subjectDIAGNOSTICS-
dc.subjectSIMULATION-
dc.subjectCL-2-
dc.titleOn the etching mechanism of ZrO2 thin films in inductively coupled BCl3/Ar plasma-
dc.typeArticle-
dc.contributor.affiliatedAuthorMin, Nam-Ki-
dc.contributor.affiliatedAuthorKwon, Kwang-Ho-
dc.identifier.doi10.1016/j.mee.2007.07.009-
dc.identifier.scopusid2-s2.0-40249108240-
dc.identifier.wosid000253030300018-
dc.identifier.bibliographicCitationMICROELECTRONIC ENGINEERING, v.85, no.2, pp.348 - 354-
dc.relation.isPartOfMICROELECTRONIC ENGINEERING-
dc.citation.titleMICROELECTRONIC ENGINEERING-
dc.citation.volume85-
dc.citation.number2-
dc.citation.startPage348-
dc.citation.endPage354-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaEngineering-
dc.relation.journalResearchAreaScience & Technology - Other Topics-
dc.relation.journalResearchAreaOptics-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryEngineering, Electrical & Electronic-
dc.relation.journalWebOfScienceCategoryNanoscience & Nanotechnology-
dc.relation.journalWebOfScienceCategoryOptics-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.subject.keywordPlusDIELECTRIC-CONSTANT MATERIALS-
dc.subject.keywordPlusHIGH-DENSITY-
dc.subject.keywordPlusGLOBAL-MODEL-
dc.subject.keywordPlusELECTRON TEMPERATURES-
dc.subject.keywordPlusZIRCONIUM-OXIDE-
dc.subject.keywordPlusSILICON-
dc.subject.keywordPlusDIAGNOSTICS-
dc.subject.keywordPlusSIMULATION-
dc.subject.keywordPlusCL-2-
dc.subject.keywordAuthorZrO2-
dc.subject.keywordAuthoretch rate-
dc.subject.keywordAuthordissociation-
dc.subject.keywordAuthorionization-
dc.subject.keywordAuthoretch mechanism-
dc.subject.keywordAuthorBCl3/Ar plasma modeling-
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