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Thermal conductivity of silicon nanowires embedded on thermoelectric platforms

Authors
Choi, JinYongCho, KyoungahYoon, Dae SungKim, Sangsig
Issue Date
Oct-2016
Publisher
IOP PUBLISHING LTD
Keywords
Si nanowires; thermal conductivity; plastic; heat transfer; thermoelectric module
Citation
MEASUREMENT SCIENCE AND TECHNOLOGY, v.27, no.10
Indexed
SCIE
SCOPUS
Journal Title
MEASUREMENT SCIENCE AND TECHNOLOGY
Volume
27
Number
10
URI
https://scholar.korea.ac.kr/handle/2021.sw.korea/87447
DOI
10.1088/0957-0233/27/10/105007
ISSN
0957-0233
Abstract
In this study, we propose a simple method for obtaining the thermal conductivity of silicon nanowires (SiNWs) embedded on a thermoelectric platform. The approximation of the heat flux in SiNWs with temperature differences enables the determination of thermal conductivity. Using this method, the thermal conductivities of our n- and p-type SiNWs are found to be 18.06 +/- 0.12 and 20.29 +/- 0.77 W m(-1).K-1, respectively. The atomic weight of arsenic ions in the n-type SiNWs is responsible for a lower thermal conductivity than that of boron ions in the p-type SiNWs. Our results demonstrate that this simple method is capable of measuring the thermal conductivity of thermoelectric nanomaterials embedded on thermoelectric devices.
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