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Fabrication of high-speed polyimide-based humidity sensor using anisotropic and isotropic etching with ICP
- Authors
- Kim, Jae Sung; Lee, Myung Jin; Kang, Moon-Sik; Yoo, Kum-Pyo; Kwon, Kwang-Ho; Singh, V. R.; Min, Nam Ki
- Issue Date
- 29-May-2009
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- Polyimide; Local curing; Humidity sensor; ICP etching
- Citation
- THIN SOLID FILMS, v.517, no.14, pp.3879 - 3882
- Indexed
- SCIE
SCOPUS
- Journal Title
- THIN SOLID FILMS
- Volume
- 517
- Number
- 14
- Start Page
- 3879
- End Page
- 3882
- ISSN
- 0040-6090
- Abstract
- A novel high-speed, high-sensitivity capacitive-type humidity sensor is fabricated by using a new microfabrication process involving combination of directional and isotropic etching with inductively coupled plasma (ICP) etcher and a localized curing of polyimide films on a micro-hotplate. The polyimide humidity sensor is found to have a sensitivity of 0.75 pF/%RH, a linearity of 0.995, a hysteresis of 1.32%RH, a time response of 3 s, and a temperature coefficient of 0.22%RH/degrees C. This high-sensitivity and high-speed device is achieved using the locally-cured polyimide and a sensor structure having many holes and allowing moisture to diffuse through the top and side surfaces of polyimide film. (c) 2009 Elsevier B.V. All rights reserved.
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Related Researcher
- Kwon, Kwang Ho
- Department of Control and Instrumentation Engineering