On the etching mechanism of ZrO2 thin films in inductively coupled BCl3/Ar plasma
- Authors
- Kim, Mansu; Min, Nam-Ki; Yun, Sun Jin; Lee, Hyun Woo; Efremov, Alexander; Kwon, Kwang-Ho
- Issue Date
- 2월-2008
- Publisher
- ELSEVIER
- Keywords
- ZrO2; etch rate; dissociation; ionization; etch mechanism; BCl3/Ar plasma modeling
- Citation
- MICROELECTRONIC ENGINEERING, v.85, no.2, pp.348 - 354
- Indexed
- SCIE
SCOPUS
- Journal Title
- MICROELECTRONIC ENGINEERING
- Volume
- 85
- Number
- 2
- Start Page
- 348
- End Page
- 354
- URI
- https://scholar.korea.ac.kr/handle/2021.sw.korea/124130
- DOI
- 10.1016/j.mee.2007.07.009
- ISSN
- 0167-9317
- Abstract
- The etching mechanism of ZrO2, thin films in BCl3/Ar plasma was investigated using a combination of experimental and modeling methods. It was found that an increase in the Ar mixing ratio causes the non-monotonic behavior of the ZrO2, etch rate which reaches a maximum of 41.4 nm/min at about 30-35% Ar. Langmuir probe measurements and plasma modeling indicated the noticeable influence of a BCl3/Ar mixture composition on plasma parameters and active species kinetics that results in non-linear changes of both densities and fluxes for Cl. BCl2, and BCl2+. From the model-based analysis of surface kinetics, it was shown that the non-monotonic behavior of the ZrO2, etch rate can be associated with the concurrence of chemical and physical pathways in ion-assisted chemical reaction. (c) 2007 Elsevier B.V. All rights reserved.
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Collections - College of Science and Technology > Department of Electro-Mechanical Systems Engineering > 1. Journal Articles
- Graduate School > Department of Control and Instrumentation Engineering > 1. Journal Articles
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