Kim, Jae Choon; Lee, Dong Jin; Hwang, Sung Woo; Ju, Byeong-Kwon; Yun, Sang Kyeong; Park, Heung-Woo; Chung, Jin Taek
ArticleIssue Date2011CitationIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.1, pp.119 - 124PublisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC